ASIP & APACT Partner for ₹2,500 Cr OSAT Unit in Andhra Pradesh

In a major boost to India’s electronics manufacturing landscape, Andhra Pradesh has broken ground for South India’s first semiconductor manufacturing facility approved under the India Semiconductor Mission (ISM 1.0). Located on a 30-acre site at Tarluvada village near Visakhapatnam, the ₹2,500 crore Outsourced Semiconductor Assembly and Test (OSAT) facility is being set up by Advanced System in Package Technologies (ASIP) in collaboration with South Korea’s APACT.

Prime Minister Narendra Modi virtually laid the foundation stone for the project on August 1, 2026. The initial phase represents an investment of over ₹460 crore, with expansion planned for subsequent phases. With an annual capacity to package and test nearly 96 million chips, the project is set to create over 1,000 direct skilled jobs and establish Andhra Pradesh as a vital semiconductor hub.

News by Rahul Yelligetti.