India's Chip Ambitions Soar: Four New Projects Approved

The Union Cabinet, led by Prime Minister Narendra Modi, has approved four new semiconductor projects under the India Semiconductor Mission (ISM), with a total investment of approximately ₹4,600 crore.

This development strengthens India’s growing semiconductor ecosystem, which now includes 10 ISM-approved projects worth ₹1.60 lakh crore across six states. The newly approved projects are:

SiCSem and 3D Glass Solutions in Bhubaneswar, Odisha, Continental Device India (CDIL) in Mohali, Punjab, Advanced System in Package Technologies (ASIP) in Andhra Pradesh

SiCSem, in partnership with UK-based Clas-SiC Wafer Fab, will establish India’s first commercial compound semiconductor fab, with an annual capacity of 60,000 wafers. 3D Glass Solutions will set up a state-of-the-art glass-based substrate and packaging facility.

ASIP, collaborating with South Korea’s APACT, will manufacture 96 million advanced packaging units annually for use in electronics. Meanwhile, CDIL will scale up discrete semiconductor production, targeting 158.38 million units per year.

Together, these projects are expected to create over 2,000 skilled jobs, boost domestic chip design and manufacturing capabilities, and support key sectors such as defence, electric vehicles, artificial intelligence, telecommunications, and renewable energy.

News by Rahul Yelligetti.