Kaynes Semicon Powers Up India's Chip Ambition

Kaynes Semicon, a wholly owned subsidiary of Kaynes Technology India, has achieved a significant milestone with the shipment of 900 units of India’s first commercially packaged Multi-Chip Module (MCM)—the Intelligent Power Module (IPM5)—from its advanced OSAT facility in Sanand on 15 October 2025.

The modules were delivered to Alpha & Omega Semiconductor (AOS), a US-based global leader in power semiconductors. The IPM5 integrates 17 semiconductor dies, including IGBTs, controller ICs, FRDs, and diodes, into a compact, high-efficiency module, designed for advanced power electronics applications.

This shipment marks the beginning of commercial production under the India Semiconductor Mission 1.0, with mass production slated for January 2026 and a planned scale-up to 1.5 million chips per day by Q1 FY27. At full capacity, the Sanand facility is expected to produce up to 6.3 million chips per day.

The achievement highlights Kaynes Semicon’s technological and manufacturing capabilities, adherence to global quality standards, and reinforces India’s emergence as a competitive player in advanced semiconductor packaging and production for global markets.

News by Rahul Yelligetti.