Tata Electronics, ASMPT to Enhance Semiconductor Mfg in India

Tata Electronics has entered into a memorandum of understanding (MoU) with ASMPT Singapore to bolster its semiconductor manufacturing capabilities. This strategic partnership is set to establish advanced semiconductor assembly equipment and infrastructure for Tata Electronics’ chip packaging units located in Assam and Karnataka.

Under the MoU, ASMPT will provide comprehensive support, including workforce training, service engineering infrastructure, and automation solutions. The collaboration will also focus on advancing research and development (R&D) in critical areas such as wirebond, flip chip, advanced packaging, and integrated system packaging. These initiatives are pivotal for the readiness and efficiency of Tata Electronics’ semiconductor assembly and test facilities in Vemagal, Karnataka, and Jagiroad, Assam.

The partnership aims to foster a robust semiconductor ecosystem in India by enhancing energy and material efficiency. It is expected to contribute significantly to the growth and sustainability of the semiconductor supply chain within the country. The focus on sustainable practices aligns with broader goals of promoting environmentally responsible industrial development.

Tata Electronics is investing ₹1,18,000 crore in establishing two major semiconductor units—a semiconductor fab in Dholera, Gujarat, and a Semiconductor Assembly and Test (OSAT) Facility in Jagiroad, Assam. This investment is projected to create nearly 50,000 direct and indirect jobs, significantly impacting the local economy and the broader semiconductor industry.

This development confirms the MoU as a crucial step in advancing India's semiconductor capabilities, with implications for enhanced technological expertise and economic growth. The partnership with ASMPT will play a key role in elevating Tata Electronics' manufacturing operations and contributing to India's position in the global semiconductor market.

News by Rahul Yelligetti