Intel CEO to Inaugurate Odisha's New Semiconductor Hub

Intel CEO Lip-Bu Tan is expected to visit Odisha later this year for the ground-breaking ceremony of 3D Glass Solutions’ (3DGS) upcoming semiconductor packaging facility, a senior state official confirmed.

Vishal Kumar Dev, Principal Secretary, Odisha Electronics and IT Department, stated that the event will be scheduled once the CEO’s visit is finalised. The project, to be implemented by Heterogeneous Integration Packaging Solutions—a venture backed by Intel, Lockheed Martin, and Applied Materials—entails an investment of ₹1,943 crore and will have an annual production capacity of five crore units.

In parallel, SicSem, in collaboration with UK-based Clas-SiC Wafer Fab, will break ground next month on India’s first integrated silicon carbide (SiC) fabrication facility at InfoValley, Bhubaneswar. Production is expected to begin within two years. Separately, RIR Power Electronics is developing a ₹618 crore SiC wafer fab, targeting commercial output by March 2026.

To support this growing semiconductor ecosystem, the Odisha government has updated its semiconductor policy, matching 50% of Central incentives and offering ₹10,000 in support for engineering students pursuing semiconductor-related studies. In addition, two new electronics manufacturing MoUs worth ₹2,655 crore have recently been signed, further strengthening the state’s position as an emerging electronics and semiconductor hub.

News by Rahul Yelligetti.