The Angstrom Revolution: IISc's 2D Materials for Next-Gen Chips

A 30-member team from the Indian Institute of Science (IISc) has proposed a groundbreaking project to the Indian government, aiming to develop next-generation semiconductors using 2D materials.

The initiative focuses on creating angstrom-scale chips—nearly one-tenth the size of today’s smallest commercial semiconductors—marking a shift beyond traditional silicon-based technology. Leveraging ultra-thin materials like graphene and transition metal dichalcogenides (TMDs), the project envisions ultra-compact, energy-efficient chips surpassing the capabilities of current three-nanometer nodes produced by global leaders such as Samsung and MediaTek.

The detailed project report (DPR) was first submitted to the Principal Scientific Adviser (PSA) in April 2022, revised in October 2024, and later shared with the Ministry of Electronics and Information Technology (MeitY). Officials have expressed optimism, with MeitY exploring potential applications and holding high-level discussions.

IISc has requested ₹500 crore in funding over five years, with a roadmap for long-term self-sufficiency after the initial phase.

News by Rahul Yelligetti.